Engineering researchers develop revolutionary diamond fabrication technology
A research team led by Professor Zhu Zhiqin, Associate Professor of the Department of Electrical and Electronic Engineering, Faculty of Engineering, Hong Kong University, and Professor Lin Yuan, Professor of the Department of Mechanical Engineering, developed a breakthrough technology with Professor Li Guihei, Assistant Professor of Southern University of Science and Technology and Peking University Dongguan Optoelectronics Research Professor Wang Qi collaborated to develop a method for large-scale production of ultra-thin and ultra-flexible diamond membranes.
These ultrathin and ultraflexible diamond films are compatible with existing semiconductor manufacturing technologies and therefore can in principle be fabricated into a variety of electronic, photonic, mechanical, acoustic and quantum devices.
The innovative edge-exposed peeling method discovered by the team facilitates the rapid production of scalable, free-standing diamond films. This approach is superior to traditional methods, which are often time-consuming, expensive and limited in scale. Notably, the new process can produce two-inch wafers in 10 seconds, providing unparalleled efficiency and scalability.
These ultra-flat diamond surfaces are critical for high-precision microfabrication and, combined with the film’s flexibility, open up new possibilities for the next generation of flexible wearable electronics and photonic devices. The research team envisions important industrial applications in electronics, photonics, mechanics, thermals, acoustics and quantum technologies.
“We hope to promote high-quality diamond films to various fields and commercialize this cutting-edge technology to provide high-quality diamond films and set new standards for the semiconductor industry. We are eager to work with academic and industrial partners to bring this revolutionary product to the market, accelerating the arrival of the diamond age.
Diamonds are recognized around the world as precious gemstones with remarkable versatility in a variety of scientific and engineering applications. They are the hardest natural materials with unparalleled thermal conductivity at room temperature, extremely high carrier mobility, dielectric breakdown strength, ultrawide bandgap, and optical transparency from the infrared to the deep ultraviolet spectrum. These remarkable properties make diamond ideal for manufacturing advanced high-power, high-frequency electronic devices, photonic devices and heat sinks to cool high power density electronic components such as those found in processors, semiconductor lasers and electric vehicles. However, the inert and rigid crystal structure of diamond poses significant challenges to fabrication and mass production, especially for ultrathin and freestanding diamond membranes, thus limiting its widespread use.
2024-12-19 20:29:15