Ventiva has just launched its innovative ICE9 thermal management kit, which operates completely silently with no moving parts. It will launch devices with up to 25W processors International Consumer Electronics Show In a few days, it’s expected to be able to cool partner laptop designs to a 40-watt TDP by 2027.
according to Vintive (PDF), the ICE9 uses the company’s Ion Cooling Engine (ICE) to cool electronics without any moving parts. The device is said to be More efficient than Frore AirJet Solid-state active cooling was released a few years ago, although it’s still slightly less efficient than an actual fan.
However, what makes Ventiva’s ICE9 thermal management kit better than typical fans is its completely silent operation and ultra-compact form factor, with the device being only 12mm tall. This makes it an ideal solution for thin and light notebooks, allowing OEMs to use relatively high-power processors while preventing thermal throttling. So, in addition to letting laptop manufacturers build stylish devices, it also allows them to plug in additional components to extend the functionality of their devices, e.g. Framework’s dual M.2 modules Insert its Framework Laptop 16 into the empty space between the expansion bay fans.
Carl Schlachte, CEO of Ventiva, said: “Our ICE technology is changing the electronics market, bringing a new wave of silent, smart heat transfer and thermal management solutions, and our latest achievements highlight the excellent scalability of ICE9 solutions.” “ICE9 Initially demonstrated in the “thin and light” notebook category with around 15W TDP, the device now enables notebook manufacturers to extend these benefits to higher performance systems, paving the way for the introduction of an entire line of silent computing products. “
The company says its ICE9 solution can currently accommodate a TDP of up to 25 watts, meaning it can handle some of the new low-power, high-performance processors from AMD and Intel, as well as Qualcomm’s Snapdragon X chips. However, it is also working with OEMs to develop cooling solutions that can handle up to 40W TDP, allowing it to easily handle some of the latest AI processors from Intel and AMD. In addition, it is open to partners leveraging “hybrid” solutions that combine ICE9 and fans for ultra-quiet computing.
While Ventiva is currently focusing on laptops for ICE9 applications, it could also be used on a variety of other devices, such as smartphones and tablets, especially given its extremely small size. However, it does have one weakness – ICE9’s static pressure is very low and OEMs cannot incorporate it into current designs if they want to maximize the technology’s cooling performance. Instead, they need to consider a hybrid solution, or build a case specifically designed for the product that allows them to efficiently transfer heat from all the laptop’s heat-generating parts so that the ICE9 can cool it directly instead of relying on The airflow a typical fan would produce. If laptop manufacturers can solve this problem, we should be prepared to see impressive improvements in silent computing performance.