SK hynix to Unveil Full Stack AI Memory Provider Vision at CES 2025

SK hynix Inc. announced today that it will showcase its innovative AI-powered memory technologies at CES 2025, which takes place in Las Vegas from January 7 to 10 (local time). The event will be attended by a large number of senior executives, including CEO Kwak No-jeong, Chief Marketing Officer (CMO) Justin Kim, and Chief Development Officer (CDO) Ahn Hyun. “At this CES, we will broadly showcase solutions optimized for on-device AI and next-generation AI memory, as well as typical AI memory products such as HBM and eSSD,” said Justin Kim. “Through this, we will promote our technological competitiveness to prepare for the future as a full-stack memory supplier for artificial intelligence.”

SK hynix will also present a joint exhibition stand with SK Telecom, SKC and SK Enmove under the theme “Innovative Artificial Intelligence, Sustainable Future”. The stand will showcase how SK Group’s artificial intelligence infrastructure and services are transforming the world represented by light waves. SK hynix, which is the first company in the world to produce 5th generation 12-layer HBM products and supply them to customers, will demonstrate samples of 16-layer HBM3E products that were officially developed in November last year. This product uses an advanced MR-MUF process to achieve the industry’s highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation efficiency.

The company will also showcase high-performance, high-capacity enterprise SSDs, including the 122TB D5-P5336 model developed by its subsidiary Solidigm last November. Featuring the largest existing capacity, high energy efficiency and space efficiency, this product has attracted significant interest from AI data center customers.

“As SK hynix succeeded in developing 61TB products based on QLC (Quadruple Level Cell) in December, we look forward to maximizing synergies based on a balanced portfolio between the two companies in the high-capacity eSSD market,” said Ahn Hyun, SK Chief Digital Officer . hinix. The company will also showcase on-device AI products such as LPCAMM2 and ZUFS 4.04, which improve processing speed and power efficiency to enable AI in edge devices such as PCs and smartphones. The company will also introduce CXL and PIM (processing in memory). technologies, as well as modular versions of CMM (CXL Memory Module)-Ax and AiMX, designed as the core infrastructure for the next generation of data centers.

In particular, CMM-Ax is an innovative product that adds compute functionality to CXL’s high-capacity memory expansion advantage, helping improve the performance and energy efficiency of next-generation server platforms.

“The world’s changes driven by artificial intelligence are expected to further accelerate this year, and in the second half of this year, SK hynix will release the 6th generation HBM (HBM4) to lead the market for customized HBMs to meet customers’ diversified needs,” said Kwak No-Yung, CEO of SK hynix. “We will continue to do our best to introduce new possibilities in the age of artificial intelligence through technological innovation and provide irreplaceable value to our customers.”