Tag: packaging

Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut Chip Lead Times
January 7, 2025

Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut Chip Lead Times

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants
January 6, 2025

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants

Samsung’s advanced chip packaging VP Lin Jun-Cheng leaves company
January 6, 2025

Samsung’s advanced chip packaging VP Lin Jun-Cheng leaves company

Samsung, Amkor, and TI finalize CHIPS deals: 2nm and advanced packaging coming to U.S.
December 22, 2024

Samsung, Amkor, and TI finalize CHIPS deals: 2nm and advanced packaging coming to U.S.

December 22, 2024

Intel Arrow Lake non-K 65W CPU box packaging leaked — Bulky design alludes to included stock cooler, likely arriving next month at CES

US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project
December 20, 2024

US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project