TSMC Is Getting Ready to Launch Its First 2nm Production Line

TSMC is making progress on its most advanced 2nm node (N2). A recent MoneyDJ report citing industry sources indicates that the company is setting up a test production line at its Hsinchu Baoshan plant (Fab 20) in Taiwan. In the early stages, TSMC is aiming for a small monthly output of around 3,000-3,500 wafers. However, the company has big plans to consolidate production at two plants in Hsinchu and Kaohsiung. TSMC expects to ship more than 50,000 wafers per month by the end of 2025, and is projected to produce about 125,000 wafers per month by the end of 2026. Broken down by location, the Hsinchu factory is expected to reach production levels of 20,000–25,000 wafers per month by the end of 2025, with that figure rising to around 60,000–65,000 by early 2027. Meanwhile, the Kaohsiung factory is expected to produce 25,000–30,000 wafers per month by the end 2025, which will also increase. to 60,000–65,000 by early 2027.

TSMC Chairman CC Wei says that the demand for these 2nm chips is higher than for 3nm chips. This increased appetite for 2nm chips is likely due to the significant improvements this technology brings: it consumes 24–35% less power, can run 15% faster at the same power level, and can accommodate 15% more transistors at the same power level. space compared to 3nm chips. Apple will be the first company to use these chips, followed by other major technology companies such as MediaTek, Qualcomm, Intel, NVIDIA, AMD and Broadcom.