US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project
December 20, 2024

US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant — plans to lend an additional $500 million for Lafayette project

The U.S. Department of Commerce said it has provided $458 million in direct funding to SK Hynix to build a $3.87 billion packaging plant and R&D facility in West Lafayette, Indiana. this mechanism It said the website is intended for artificial intelligence products and will fill “a critical gap in the U.S. semiconductor supply chain.” On top of that, it will lend the company up to $500 million — all of which will come from funding provided by the CHIPS Act.

Once completed, the project will allow HBM chips to be manufactured within the United States, which is critical for manufacturing AI chips. TSMC already operates as an Arizona fab (and is acquiring Higher output than similar facilities Taiwan), the United States can produce most components of its most advanced chips within its borders. In addition, it is expected to create 1,000 new jobs in Indiana and even boost research and development through a partnership with nearby Purdue University.

2024-12-19 18:02:05

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